Hi Tracey.
Thanks for the reply. I have understood now.
There is another question...
I'm planning to use Thermally conductive Gap Filler Pad, between the AD5410 top surface & to the aluminium body,So that the heat generated by the AD5410 does not carry on to the PCB & also does not affect the operation of AD5410.
The idea is to use the aluminium body as a heat sink to the AD5410 by connecting both of them by using a Thermally Conductive Gap filler pad.
The challenge here is to select the Gap filler pad w.r.t to thermal conductivity.
Are they any guidelines or calculation method given by AD for selecting the the right gap filler pad w.r.t thermal conductivity.
Kindly provide me the link if any or suggest what should be the thermal conductivity of the gap filler pad.